Titan Loadlocked RIE with VCE

The Titan is a very compact, fully automated, vacuum loadlocked plasma system for semiconductor production. Available in the following configurations: Reactive Ion Etch (RIE); High Density Inductive Coupled Plasma (HDICP) or DRIE. Used for advanced processing of wafers or mounted parts. It also has multiple size batch capability. Small footprint at an affordable price.

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System Features:

• PLC and touch screen control
• Electrostatic, or mechanical chuck
• Active substrate temperature control
• Vacuum cassette
• Optional laser, and optical endpoints
• Optional high density inductively coupled plasma source (HDICP)

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Applications:

Compound Etch, Dielectric Etch, Silicon Trench, MEMS, Quartz Etch, Metal Etch.

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