Etch Platform

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Plasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge (plasma) of an appropriate gas mixture being shot (in pulses) at a sample. The plasma source, known as etch species, can be either charged (ions) or neutral (atoms and radicals). During the process, the plasma will generate volatile etch products at room temperature from the chemical reactions between the elements of the material etched and the reactive species generated by the plasma. Eventually the atoms of the shot element embed themselves at or just below the surface of the target, thus modifying the physical properties of the target.


Minilock-Phantom DRIE

Minilock-Phantom DRIE

Minilock-Phantom Duo

Minilock-Phantom Duo

Minilock-Phantom RIE

Minilock-Phantom RIE

Minilock-Phantom RIE ICP

Minilock-Phantom RIE ICP


Phantom RIE

Phantom RIE

Phantom RIE ICP

Phantom RIE ICP

Phantom RIE ICP Cryo

Phantom RIE ICP Cryo


Oracle Production Cluster Tool

Oracle Production Cluster Tool

Titan Loadlocked RIE with VCE

Titan Loadlocked RIE with VCE



Custom carriers – single or four wafer carrier – for 12 inch chuck etching. 400 millimeter wafer

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