The Gemini is a compact multi-chamber, high throughput photoresist stripping system that is designed specifically for the demands of today’s production fabs. This versatile and affordable system can be configured with a 200mm or 300mm chuck. As required by application, this system can incorporate a microwave source (which is both reliable and free from typical microwave tuning problems) or ICP technology.
By employing ICP, microwave and RF bias power difficult to remove layers of resist can be removed at low temperatures.
Inductively Coupled Plasma (ICP) Option:
High Rate and Low Damage Photoresist Stripping is a critical necessity in modern semiconductor manufacture. As more and more masking steps and more sensitive devices have come into use, “plasma downstream ashing” has become the primary method of resist removal. The Trion Gemini Photoresist Stripper incorporates a downstream Inductively Coupled Plasma (ICP) to provide the high rate and uniform removal this application requires.
The Trion Gemini system was specifically designed for production Photoresist Descum and Stripping. This extremely reliable system provides a compact and inexpensive solution to this application.
Single-Chamber Option:
Photoresist Stripper Descum Application Note
“The descum operation of the Trion Photoresist Stripping platform was characterized, exploring the effects of various factors.
To complete this task, a series of runs were made in an effort to obtain relationships of non-uniformity and ash rate versus run length, power, pressure, oxygen flow, chuck temperature, DC bias, and photoresist coverage. The data was taken by varying each parameter above and below an optimized descum process. The conditions of this recipe were …”
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Stripper CHARM®-2 Report and Wafer Maps
