Trion Technology

Manufacturer of Plasma Etch & Deposition Systems for Over 25 Years

  • Home
  • Plasma Ashing
    • Apollo Stripper
    • Gemini Multi-Chamber Stripper
  • Etch Platform
    • Phantom RIE
    • Phantom RIE ICP
    • Phantom RIE ICP Cryo
    • Minilock – Phantom RIE
    • Minilock – Phantom RIE ICP
    • Minilock – Phantom DRIE
    • Minilock – Phantom Duo
    • Titan Loadlocked RIE with VCE
    • Oracle Cluster
  • Deposition Products
    • Orion PECVD
    • Orion HDCVD
    • Minilock-Orion PECVD
    • Minilock PVD
    • Minilock ALD
    • Minilock Duo
    • Titan Deposition with VCE
    • Oracle Cluster
  • Process
    • Ashing
    • Etching
      • Dielectric Etching
      • Compound Etching
      • Metal Etching
      • Silicon Etching
    • Deposition
      • Plasma Enhanced Chemical Vapor Deposition
      • High-Density Chemical Vapor Deposition (HDCVD)
    • Processing Techniques
      • Reactive Ion Etch (RIE)
      • Inductively Coupled Plasma (ICP)
      • Deep Reactive Ion Etching (DRIE)
      • Plasma Enhanced Chemical Vapor Deposition (PECVD)
      • High Density Chemical Vapor Deposition (HD CVD)
      • Physical Vapor Deposition (PVD)
      • Atomic Layer Deposition (ALD)
      • Typical Features
      • FAQs
  • Service
    • Service News
  • About
    • Blog
    • Calendar of Events
  • Contact
Navigation Menu
Home » Process Development

Production Tools

  • Apollo Stripper
  • Gemini Multi-Chamber Stripper
  • Oracle Cluster
  • Titan Loadlocked RIE with VCE
  • Titan Deposition with VCE

Research/Pilot Line Tools

  • Deposition Products
    • Minilock ALD
    • Minilock Duo
    • Minilock-Orion PECVD
    • Minilock PVD
    • Oracle Cluster
    • Orion HDCVD
    • Orion PECVD

  • Etch Platform
    • Minilock – Phantom DRIE
    • Minilock – Phantom Duo
    • Minilock – Phantom RIE ICP
    • Minilock – Phantom RIE
    • Oracle Cluster
    • Phantom RIE ICP
    • Phantom RIE ICP Cryo
    • Phantom RIE

Process Development

Posted by trion on Jul 20, 2014 in | 0 comments

Trion Applications Lab

Trion Applications Lab

Trion Technology has over 25 years’ experience in rapid process development, and operates a full Applications Laboratory that can provide guidance and support through a large process library. Trion offers process support both prior to and subsequent to purchase.


 

APPLICATIONS

Plasma Ashing
Compound Semiconductor
Failure Analysis
MEMS
Deposition

Process Development

  • Ashing
  • Etching
    • Dialectric Etching
    • Compound Etching
    • Metal Etching
    • Silicon Etching
  • Deposition
    • PECVD
  • Processing Techniques
    • Reactive Ion Etch
    • Inductively Coupled Plasma (ICP)
    • Deep Reactive Ion Etching (DRIE)
    • Plasma Enhanced Chemical Vapor Deposition (PECVD)
    • High Density Chemical Vapor Deposition (HDCVD)
    • Physical Vapor Deposition (PVD)
    • Atomic Layer Deposition (ALD)
    • FAQs

Request Quotation

©2025 Trion Technology. All Rights Reserved. Website design & hosting provided by Visual Edge Design