Failure Analysis

APPLICATION NOTES:

Phantom RIE Failure Analysis Datasheet
Silicon Oxide, Silicon Nitride, Bulk Silicon, Photoresist, Polyimide.

Phantom RIE ICP Failure Analysis Datasheet
Silicon Oxide, Silicon Nitride, Bulk Silicon, Photoresist, Polyimide.

Sirus T2 Tabletop RIE Failure Analysis Datasheet
Anisotropic removal of dielectric layers (“Skeleton Etch”), Sequential Removal, Planar Delayering

Aluminum Etch
Application: Failure Analysis, Metal Etching Aluminum
Trion Tool: Minilock-Phantom RIE
“Etching was done using Boron Tri-chloride (BCI3) and Chlorine (CI2) gas …”

Aluminum Etch
Application: Failure Analysis, Metal Etching Aluminum
Trion Tool: Minilock-Phantom RIE
“Aluminum etching is one of the most difficult processes. However, if done correctly very good etch results can be obtained. A good starting recipe for more uniform but isotropic etching of the Al is …”

Anisotropic Dielectric Removal vs. Sequential Removal
Application: Failure Analysis, Dielectric Etching

Anisotropic Etching of Polymers
Application: Failure Analysis, Dielectric Etching, Silicon Etching
Trion Tool: Phantom RIE

RIE Grass
Application: Failure Analysis, Dielectric Etching, Silicon Etching

Silicon Dioxide Etch
Application: Failure Analysis, Dielectric Etching, Silicon Etching
Trion Tool: Phantom RIE

Silicon Nitride Etch
Application: Failure Analysis, Dielectric Etching, Silicon Etching
Trion Tool: Phantom RIE

PAPERS:

Amorphous silicon thin-film transistors with 90° vertical nanoscale channel
by Isaac Chan and Arokia Nathan
Application: Failure Analysis, Dielectric Etching, Silicon Etching
Trion Tool: Phantom RIE

Plasma Basics & History of Plasma Reactors
Application: Failure Analysis

Rapid Integrated Circuit Delayering Without Grass
by W. Vanderlinde and C. Von Benken (Microelectronics Research Laboratory, Columbia, MD) and A. Crockett (Trion Technology)
Application: Failure Analysis, Dielectric Etching, Silicon Etching
Trion Tool: Minilock-Phantom RIE

Reliability Issues And Advanced Failure Analysis Deprocessing Techniques For Copper/Low-K Technology
by H. Wu, J. Cargo, C. Peridier and J. Serpiello (Agere Systems, IC Quality Organization, Product Analysis Lab, Allentown, PA)
Application: Failure Analysis, Dielectric Etching, Metal Etching Copper
Trion Tool: Phantom RIE

 

PROCESS DEVELOPMENT:

Dielectric Etching

Compound Etching

Metal Etching

Silicon Etching

PROCESSING TECHNIQUES:

Reactive Ion Etch

Inductively Coupled Plasma

Deep Reactive Ion Etch