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Address
Quote Type:
Process
Substrate Process Loading:
Substrate
2. Die Dim:
3. Die Dim
4. Die Dim:
1. Full Wafer:
1. Full Wafer:
Dim:
Thickness:
2. Full Wafer:
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Dim:
Thickness:
3. Full Wafer:
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Dim:
Thickness:
4. Full Wafer:
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Dim:
Thickness:
Substrate Base Material:
Substrate Layer Material/Type To Be Etched/Deposited:
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Substrate Layer Material Thickness And Uniformity:
Process Recipe:
If Customer Provided Recipe, Please Provide Details:
Gases Used:
Desired Uniformity:
Across Wafer:
Wafer to Wafer:
FACILITIES
Voltage Power Available:
Chill Water (PCW) (12°C > 18°C):
Compressed Air (CDA):
Vacuum:
Rough Vac:
High Vac:
Turbo Molecular Pump:
Dry Pump: