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Minilock – Phantom RIE
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Phantom RIE ICP
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Posted by
trion
on Jan 25, 2022 in |
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Technical Detail Required
Process
Etch
Single
Deposit
Batch
Strip
Substrate Process Loading:
Manual
Second Choice
Loadlock
Substrate
Die Dim: W: 50 x 50mm
2. Die Dim:
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3. Die Dim
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4. Die Dim:
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1. Full Wafer:
1. Full Wafer:
Round
Square
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2. Full Wafer:
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Square
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3. Full Wafer:
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Square
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4. Full Wafer:
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Round
Square
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Substrate Base Material:
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Substrate Layer Material/Type To Be Etched/Deposited:
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Polyimide
PMMA
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Substrate Layer Material Thickness And Uniformity:
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Process Recipe:
Customer Supply
With Tool
If Customer Provided Recipe, Please Provide Details:
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Gases Used:
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Dopant Level:
Other Mask Type:
Thickness/Uniformity:
Thickness:
Topography:
Minimum Line Width:
Mask Type And Thickness:
% Surface Coverage By Photoresist Or Other Mask:
Desired Uniformity:
Across Wafer:
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Wafer to Wafer:
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FACILITIES
Voltage Power Available:
Volt:
Ampere:
# Of Phases:
HZ:
Chill Water (PCW) (12°C > 18°C):
In-House
With Tool
Compressed Air (CDA):
PSI/Bar:
CFM:
Vacuum:
Rough Vac:
Customer Supply
With Tool
High Vac:
Customer Supply
With Tool
Turbo Molecular Pump:
Customer Supply
With Tool
Dry Pump:
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