Sirus T2 Table Top RIE
Posted by trion on Jul 20, 2014 in | 0 comments
The Sirus T2 Reactive Ion Etcher is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.
Applications
MEMS, Solid State Lighting, Failure Analysis, Research & Development, Pilot Line.
Fluorine Etch Processes
(SF6, CF4, CHF3, O2)
| • Carbon | • Si |
| • Epoxy | • SiO2 |
| • InSb | • Si3N4 |
| • Ir | • SiC |
| • Mo | • Ta |
| • Nb | • TaN |
| • OxyNitride | • TiW |
| • Polyimide | • TiN |
| • Pr (e.g: SiLK or SU8) | • W |
| • Quartz | |
Tool Standard Features
- Sirus T2 reactor with 200mm bottom electrode
- System controller (includes Pentium™ based computer and touch screen interface)
- Two mass flow controllers
- Automatic tuning with 13.56 MHz 600 watt RF generator
- Emergency Off system
- Automatic pressure control package (butterfly valve with capacitance manometer for pressure measurement)
- 12 month limited warranty
Optional Features
- Recirculating temperature controller
- Up to two additional mass flow controllers
Pumps
- 170 l/s turbo
- 23.3 cfm rotary vane pump with oil filtration, demister, and Fomblin oil
- The Sirus T2 system requires a roughing pump and either a chiller or cooling water with greater than 4 M ohm resistivity.
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