Request a Quotation

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Country *

Address 1

Address 2

City, State

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Quote Type:

Budgetary QuoteFormal QuoteTechnical Detail Required

Process:

EtchSingleDepositBatchStrip

Substrate Process Loading:

ManualCassetteLoadlock

Substrate:

Die Dim: W: 50 x 50mm

2. Die Dim:
W: x mm | Thickness: µ

3. Die Dim:
W: x mm | Thickness: µ

4. Die Dim:
W: x mm | Thickness: µ

1. Full Wafer:
RoundSquare

Dim:
Thickness: µ

2. Full Wafer:
RoundSquare

Dim:
Thickness: µ

3. Full Wafer:
RoundSquare

Dim:
Thickness: µ

4. Full Wafer:
RoundSquare

Dim:
Thickness: µ

Substrate Base Material:

1. 2.

3. 4.

5. 6.

7. 8.

9.

Substrate Layer Material/Type To Be Etched/Deposited:

1. Polyimide                        2. PMMA

3. 4.

5. 6.

7. 8.

9.

Substrate Layer Material Thickness And Uniformity:

1. µ/Å     2. µ/Å

3. µ/Å     4. µ/Å

5. µ/Å     6. µ/Å

7. µ/Å     8. µ/Å

9. µ/Å

Process Recipe:
Customer SupplyWith Tool

If Customer Provided Recipe, Please Provide Details:

Gases Used:

1. 2.

3. 4.

5. 6.

7. 8.

9.

Desired Uniformity:

Across Wafer:
+/- %

Wafer to Wafer:
+/- %

FACILITIES

Voltage Power Available:

Volt:

Ampere:

# Of Phases:

HZ:

Chill Water (PCW) (12°C > 18°C):
In-HouseWith Tool

Compressed Air (CDA):

PSI/Bar:

CFM:

Vacuum:

Rough Vac:
Customer SupplyWith Tool

High Vac:
Customer SupplyWith Tool

Turbo Molecular Pump:
Customer SupplyWith Tool

Dry Pump:
Customer SupplyWith Tool