|
Oracle Loadlocked RIE/PECVD with Vacuum Cassette Elevator
The Oracle III is the smallest and most flexible full production cluster system on the market. The system consists of a central vacuum transport (CVT), vacuum cassette elevators and up to four process reactors. These process reactors are docked to the central load-lock and run in production-mode or can be operated independently. The Oracle III can also be configured for either the laboratory environment (with single wafer loading) or for full production (with vacuum cassette elevators).
Because the Oracle III accommodates up to four separate process chambers, there are many possible process combinations, including RIE/ICP etch and PECVD. Processes are safely run without atmospheric contamination since all chambers are vacuum load-locked.
| Applications |
| Compound Semiconductor, Photonics, Research & Development, Pilot Line, Production |
PECVD Processes |
|
Films Deposited: |
|
Process Gases: |
• |
Oxides |
• |
100% Silane |
• |
Oxynitrides |
• |
<20% Silane |
• |
Nitrides |
• |
Ammonia |
• |
Amorphous Silicon |
• |
TEOS |
• |
Silicon Carbide |
• |
Diethylsilane |
|
|
• |
Nitrous Oxide |
|
|
• |
Oxygen, Nitrogen |
|
|
• |
Trimethylsilane |
|
|
• |
Methane |
|
Fluorine Etch Processes
(SF6, CF4, CHF3, O2) |
• |
Carbon |
• |
Quartz |
• |
Epoxy |
• |
Si |
• |
GaAs/AlGaAs |
• |
SiO2 |
• |
InSb |
• |
Si3N4 |
• |
Ir |
• |
SiC |
• |
Mo |
• |
Ta |
• |
Nb |
• |
TaN |
• |
OxyNitride |
• |
TiW |
• |
Polyimide |
• |
TiN |
|
Pr (e.g: SiLK or SU8) |
• |
W |
|
Corrosive Chemistry Etch Processes
(Cl2, BCl3, SiCl4, HBr, NF3, etc.) |
• |
Al |
|
Compound stacks
Al, As, Ga, In, P |
• |
Au |
• |
InP |
• |
Cr |
• |
Polysilicon |
• |
Cu |
• |
Pt |
• |
Carbon |
• |
Si |
• |
GaAs |
• |
SiC |
• |
GaN |
• |
Ti |
|
|
| Cluster Tool Features |
Central Vacuum Transport - Safe and contamination-free processing requires the process to be isolated from the surrounding environment. The way to do this is with a vacuum load-locked cluster consisting of a robotic arm, load-locked transfer cluster and reactor isolation valve. The central vacuum transport (CVT) comes with a direct drive, pick and place robot. Each CVT can accommodate up to four reaction chambers and up to two vacuum cassette elevators. |
| |
Manual Loadlock - The manual load-lock port allows the manual loading of a single wafer for R&D, pilot line or to run priority wafers. |
| |
Vacuum Cassette Elevator - The vacuum cassette elevator (VCE) allows high throughput, cassette-to-cassette capability for production applications. The Oracle III can have one or two VCE’s plus a manual load port. |
| |
Touch Screen Operator Interface - A color flat panel display with touch screen interface provides the operator with full process information at all times. The software guides the operator through each sequence in a logical fashion and gives touch control of all process conditions. |
| |
AC Distribution Module - The AC distribution module automatically distributes predefined power quantities to the various internal components. When the Emergency Power Off button is tripped, the RF power is shut off and all valves involved with gas delivery are automatically closed and the machine powers down to a safe standby mode. This system includes separate power controls for the main AC and peripherals. |
| Process Module Features |
Reactor - The cathode and anode are each machined out of single blocks of aluminum. After critical inspection they are hard anodized for protection from process chemistries. The bottom electrode is available in either 200mm or 300mm sizes and depending on electrode configuration, can process single wafers from 3" - 300mm. Process gases are introduced into the chamber either by an annular ring or a showerhead manifold. |
| |
Automatic Matching Network - The uniquely designed matching network is built in as an integral part of the bottom electrode assembly to ensure accurate tuning, low transmission loss and virtually no RF radiation outside the network itself. The network uses a phase magnitude sensor and amplifiers to provide instantaneous feedback for quick precise tuning. |
| |
RF Generator - The system comes standard with a 600 watt, 13.56 MHz solid state RF generator. |
| |
PC Process Controller - The PC process controller provides simple and reliable system control. The graphical software package creates programs in block diagram form. Process recipes are stored on the hard drive or can be stored on USB flash drives allowing each operator to maintain individual recipes. |
| |
Automatic Pressure Control - Every Trion system includes a butterfly pressure control valve operated directly by the process controller. This provides independent pressure control separate from all other process parameters. |
| |
Gas Delivery System - State-of-the-art technology is utilized to ensure the utmost integrity and purity. Each reaction chamber accommodates up to eight mass flow controllers and all plumbing utilizes surface mount, C-seal technology or orbital welded VCR fittings. |
| |
Safety - The system meets all SEMI_S2-0703 safety requirements. A third party safety review is available upon request. |
| |
| Facilities - Facility schematics can be provided upon request. |
| Tool Advanced Options |
Custom Gas Cabinets - Trion provides remote gas cabinets with self-closing doors, which house gas delivery and purge systems for corrosive or toxic gases controlled by the on-board computer. The system automatically purges the process supply lines with nitrogen when the system is placed in standby mode. This extends the life of the mfc’s, regulators, valves and associated plumbing. Included are automatic “at-the-bottle” shut off valves and stainless steel lecture bottle holders. |
| |
Pumping Systems - Each reaction chamber requires its own pump. Trion can supply these as needed according to your requirements. There are mechanical, dry and turbo pump options available. You may choose to provide your own pump(s) or they can be purchased directly from Trion. All pump options provided by Trion are proven systems chosen to best meet your specific process needs. |
| |
Temperature Control - For certain processes an external chiller or heater/chiller may be recommended. By controlling the reactor temperature (bottom electrode), process reproducibility is greatly enhanced and the etch by-products more readily volatilized. |
| |
Endpoint Detection Systems - Trion offers both optical and laser endpoint detection options which allows the user to measure film thickness changes in-situ during the etch process. These systems are integrated into and controlled by Trion software. |
| |
Inductively Coupled Plasma - Trion’s ICP is a proven option for applications requiring a downstream, high-density plasma source. It dramatically reduces radiation damage and contamination from RIE sputtering and greatly increases selectivity to other films. It allows for higher plasma densities as power is transferred into the bulk plasma via the magnetic field resultant from inductive coupling. This enables processing at lower pressure, which has a number of significant benefits. It allows for anisotropy in high aspect ratio structures and reduces micro-loading effects. Trion’s ICP source will result in improved etch rates, profile control, uniformity and selectivity with a dramatic reduction in RIE radiation damage. |
| |
Electrostatic Chuck - Maintaining cooler substrate temperatures during etching is often critical. Trion’s electrostatic chuck holds the wafer securely to the chuck by electrostatic forces while flowing a small quantity of helium onto the backside of the wafer, providing greatly enhanced heat transfer. |
For Technical Articles and SEMS, please visit our Applications Page.
Download the Oracle III brochure.
This brochure is in PDF format. If you do not have Adobe Acrobat Reader, Click Here.
Click Here for more information.
|
