Titan
Loadlocked RIE or PECVD
with Vacuum Cassette Elevator

A very compact, fully automated, vacuum loadlocked plasma system for semi-conductor production. Available in either Reactive Ion Etch (RIE) configuration, High Density Inductive Coupled Plasma (HDICP) or Plasma Enhanced Chemical Vapor Deposition (PECVD) configuration. Used for advanced processing of wafers or mounted parts. It also has multiple size batch capability. Small footprint at an affordable price.

Etch Applications

Gallium Arsenide, Aluminum Gallium Arsenide, Gallium Nitride, Indium Phosphide, Aluminum, Silicides, Chrome and other materials requiring both corrosive and non-corrosive chemistries.

Deposition Applications

Silicon dioxide, Silicon Nitride, Oxynitride, and various other materials.