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Products - Lab Platform - Sirus T2 Table Top
Sirus T2 Table Top Reactive Ion Etch (RIE) System
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The Sirus T2 Reactive Ion Etcher is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.

Applications
MEMS, Solid State Lighting, Failure Analysis, Research & Development, Pilot Line.

Fluorine Etch Processes
(SF6, CF4, CHF3, O2)

Carbon Quartz
Epoxy Si
GaAs/AlGaAs SiO2
InSb Si3N4
Ir SiC
Mo Ta
Nb TaN
OxyNitride TiW
Polyimide TiN
Pr (e.g: SiLK or SU8) W

Tool Standard Features
Sirus T2 reactor with 200mm bottom electrode
System controller (includes Pentium™ based computer and touch screen interface)
Two mass flow controllers
Automatic tuning with 13.56 MHz 600 watt RF generator
Emergency Off system
Automatic pressure control package (butterfly valve with capacitance manometer for pressure measurement)
12 month limited warranty

Optional Features
Recirculating temperature controller
Up to two additional mass flow controllers

Pumps
170 l/s turbo
23.3 cfm rotary vane pump with oil filtration, demister, and Fomblin oil

For Technical Articles and SEMS, please visit our Applications Page.

Download the Sirus T2 brochure.
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