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Products - Lab Platform - Sirus T2 Table Top

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Sirus T2 Table Top Reactive Ion Etch (RIE) System

The Sirus T2 Reactive Ion Etcher is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.

Applications

MEMS, Solid State Lighting, Failure Analysis, Research & Development, Pilot Line.

Fluorine Etch Processes
(SF6, CF4, CHF3, O2)

•	Carbon	•	Quartz
•	Epoxy	•	Si
•	GaAs/AlGaAs	•	SiO2
•	InSb	•	Si3N4
•	Ir	•	SiC
•	Mo	•	Ta
•	Nb	•	TaN
•	OxyNitride	•	TiW
•	Polyimide	•	TiN
	Pr (e.g: SiLK or SU8)	•	W

Tool Standard Features

•	Sirus T2 reactor with 200mm bottom electrode
•	System controller (includes PentiumT based computer and touch screen interface)
•	Two mass flow controllers
•	Automatic tuning with 13.56 MHz 600 watt RF generator
•	Emergency Off system
•	Automatic pressure control package (butterfly valve with capacitance manometer for pressure measurement)
•	12 month limited warranty

Optional Features

•	Recirculating temperature controller
•	Each extra mass flow controller (4 max)

Pumps

•	23.3 cfm rotary vane pump with oil filtration, demister, and Fomblin oil
•	The Sirus T2 system requires a roughing pump and either a chiller or cooling water with greater than 4 M ohm resistivity

For Technical Articles and SEMS, please visit our Applications Page.

Download the Sirus T2 brochure.
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