Silicon Etching

1. Silicon Reactive Ion Etch (RIE)
2. Silicon RIE using Inductively Coupled Plasma (ICP)
3. Silicon Deep Reactive Ion Etch


 

1. Silicon Reactive Ion Etch (RIE)

Anisotropic Etching of Polymers
Application: Failure Analysis; Dielectric Etching; Silicon Etching
Trion Tool: Phantom RIE

Polyimide Etch
Application: Failure Analysis; Dielectric Etching; Silicon Etching
Trion Tool: Phantom RIE

Polysilicon Etch 
Application: Failure Analysis; Dielectric Etching; Silicon Etching
Trion Tool: Minilock-Phantom RIE

RIE Grass
Application: Failure Analysis; Dielectric Etching; Silicon Etching

Silicon Dioxide Etch
Application: Failure Analysis; Dielectric Etching; Silicon Etching
Trion Tool: Phantom RIE
Silicon Nitride Etch
Application: Failure Analysis; Dielectric Etching; Silicon Etching
Trion Tool: Phantom RIE

Plasma Delayering of Integrated Circuits
by A. Crockett and M. Almoustafa (Trion Technology) and W. Vanderlinde (Laboratory for Physical Sciences, College Park, MD)
Application: Failure Analysis; Dielectric Etching; Silicon Etching

Rapid Integrated Circuit Delayering Without Grass
By W. Vanderlinde and C. Von Benken (Microelectronics Research Laboratory, Columbia, MD) and A. Crockett (Trion Technology)
Application: Failure Analysis; Dielectric Etching; Silicon Etching
Trion Tool: Minilock-Phantom RIE


 

2. Silicon RIE using Inductively Coupled Plasma (ICP)

What is ICP?


TSV Etch

TSV Etch (ICP)

A TSV is a vertical electrical connection passing completely through the silicon wafer. The formation of this structure requires a highly anisotropic etch process, with silicon to resist selectivity high enough to allow for trenches with a depth of greater than 500µm.  This non-switched process can achieve etch rates 10µm/min.


Fast Switch Etch

Fast Switch Etch (ICP)

The process consists of two gasses that are active in the etching of silicon, the Etching Gas and the Passivation Gas, and can achieve etch rates over 10µm/min

Hybrid Reactors & Deep Oxide (Skeleton) Etch

Contamination resistant antireflection nano-textures in fused silica for laser optics

By Douglas Hobbs, Bruce MacLeod, Ernest Sabatino III from TelAztec LLC and Jerald Britten, Christopher Stolz from Lawrence Livermore National Laboratory

Application: Silicon RIE/ICP

Trion Tool: Phantom RIE/ICP



 

3. Silicon Deep Reactive Ion Etch (DRIE)

Hybrid Reactors & Deep Oxide (Skeleton) Etch
Application: Failure Analysis; Dielectric Etching; Silicon Etching ICP

Selective Reactive Ion Etching of P-Doped Polysilicon Using a Cl2/HBr Mixture
Trion Tool: Minilock-Phantom RIE

Controlled Multi-Batch Self-Assembly of Micro Devices by X. Xiong, University of Washington
Application: MEMS
Trion Tool: RIE

Double-Sided Micromachining Process for Silicon Cantilever Using a Parallel Capacitively Coupled Plasma by W. Wang, J. Ho, and P. Reinhall, University of Washington
Application: MEMS
Trion Tool: Phantom RIE

Fully Micromachined Power Combining Module for Millimeter-Wave Applications by Y. Lee, University of Michigan
Application: MEMS – Deep GaAs Etch
Trion Tool: RIE, Oracle Plasma Etch & Deposition System with Electrostatic Chuck and He Backside Cooling

Low-Stress Silicon Carbonitride for the Machining of High-Frequency Nanomechanical Resonators by L. Fischer, N. Wilding, M. Gel, and S. Evoy, University of Alberta
Application: Deposition, MEMS
Trion Tool: Phantom RIE; Orion PECVD

Micromachining of Non-Fouling Coatings for Bio-MEMS Applications by Y. Hanein, Y. Pan, B. Ratner, D. Denton, K. Bohringer, University of Washington
Application: MEMS
Trion Tool: RIE

Thermal Cycling Design Alternatives for the Polymerase Chain Reaction by M. Lewis, University of Maryland
Application: MEMS – Medical
Trion Tool: Minilock-Phantom RIE


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