The Orion Plasma Enhanced Chemical Vapor Deposition System produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels. The system meets all safety, facility and process requirements within the laboratory and pilot line production environments. The Orion has many standard features not typically found on a system so reasonably priced, which is why many users worldwide have made it their PECVD system of choice.

“I’ve found both machines (Orion PECVD and Phantom RIE) to be quite robust, indestructible by comparison to some other lab equipment.” – Lee M. Fischer, National Institute for Nanotechnology, University of Alberta


MEMS, Solid State Lighting, Failure Analysis, Research & Development, Pilot Line.

Non-pyrophoric PECVD Processes

Films Deposited:

  • Oxides
  • Oxynitrides
  • Nitrides
  • Amorphous Silicon

Process Gases:

  • <20% Silane
  • Ammonia
  • TEOS
  • Diethylsilane
  • Nitrous Oxide
  • Oxygen, Nitrogen

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