Minilock ALD

Minilock ALD


The Minilock ALD system has been designed to provide researchers with the capability to grow Atomic Layer Deposition films through both thermal, and plasma-enhanced modes for substrate sizes up to 300mm. The small footprint and robust design make it ideal for research, and pilot line environments. A biased electrode is standard, which can be used to change the film properties.


Remote Microwave Plasma for ALD

Remote Microwave Plasma for ALD

By keeping our core components the same, it is very easy to scale to a production cluster platform.

Standard processes have been developed for various materials. This is backed by over 25 years’ experience in rapid process development.


System Features:

  • PLC and touch screen control
  • Inductively coupled plasma source (ICP)
  • Biased electrode
  • Close coupled precursor delivery (max 8)
  • 50°C to 400°C chuck
  • 4 Precursor entry points
  • 400l/s Maglev turbo
  • Vacuum loadlock

Options:

  • Microwave source (Compared with ICP, a remote microwave plasma produces a lower content of energetic ions, and the flow of radicals generated can produce much lower damage to the substrate.)
  • PECVD processes
  • Cluster tool compatible
  • 600°C Stainless steel electrode

Process Page


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