Applications
Failure Analysis
MEMS
Deposition
Other
Process Highlights
Materials supported by Trion’s tools include:
ETCH
Aluminum (Al) - anisotropic
Cl2 + BCl3
Aluminum (Al) - isotropic
Aluminum Gallium Arsenide (AlGaAs)
SiCl4 + BCl3 + Ar
Aluminum Nitride (AlN)
Black Diamond
CF4
BPSG
CHF3/ (02 or Ar)
Carbon (C)
O2 + Argon
Chrome (Cr)
Cl2 + O2
Copper (Cu)
BCl3 + Cl2 (heat)
Epoxy
O2 + %5 CF4
Gallium Antimonide (GaSb)
Ar + Cl2 (5:1)
Gallium Arsenide (GaAs) - thinning
Cl2 + BCl3 (isotropic)
Gallium Arsenide (GaAs) - profile
Cl2+BCl3 (anisotropic)
Gallium Arsenide (GaAs)
GaAs/AlGaAs - selective etch
SF6 + BCl3
Gallium Nitride (GaN)
Cl2
Gold
HBr + BCI3
Graphite (C)
Indium & Aluminum - containing III-V's
Indium Phosphide (InP)
CH4 + H2
Iridium (Ir)
SF6
Molybdenum (Mo)
Oxynitride
CF4 + 5% O2
Photoresist
O2
Platinum
Cl2, Ar (90oC)
Polyimide
O2 + Ar
Polysilicon - isotropic
Polysilicon - anisotropic
PSG
CF4 / (O2 or Ar)
Quartz
CHF3 + CF4
Sapphire (Al2O3)
BCl3
Silicon (Si)
CF4 + 2% O2
Silicon Carbide (SiC)
NF3 + O2
Silicon Dioxide (SiO2)
CF4 + CHF3
SiLK (Pr)
SU8 (Pr)
O2 + CF4
O2 + Ar + CF4
Silicon Nitride (Si3N4)
SF6/O2 or CF4/O2
Tantalum - anisotropic
CF4 + O2
Tantalum - isotropic
Tantalum Nitride (TaN)
Titanium (Ti)
Tinitride (TiN)
Titanium Tungsten (TiW) - isotropic
Titanium Tungsten (TiW) - anisotropic
Tungsten (W) - isotropic
Tungsten (W) - anisotropic
Amorphous Silicon
SiH4
Oxide
TEOS + O2
Oxide - faster deposition
SiH4 + N20 +N2
Nitride
NH3 + DES + N2
Nitride - faster deposition
N2 + NH3 + SiH4
Silicon carbide
Trimethylsilane or Methane (CH4) & SiH4
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